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Powertech’s PiFO Gambit: A Second Source for AI Packaging

Powertech Technology (6239.TW) has spent nearly three decades as the world’s largest memory packaging and testing company. Now, as advanced packaging becomes the tightest bottleneck in the AI supply chain, Powertech is positioning itself as the credible alternative to TSMC’s CoWoS platform. With a proprietary glass-substrate technology that rivals TSMC at significantly lower cost, Powertech has gone from quiet memory specialist to one of the most strategically important companies in the AI chip ecosystem.